Product description
S200 TG ARGB Snow Mid Tower Chassis is an ATX case with a mesh front panel and comes with three preinstalled hydraulic bearing 120 mm ARGB Lite front fans. Besides, up to six 120 mm fans can be fitted in the chassis and up to a 360 mm radiator can to placed at the front of the S200 TG ARGB Snow mid-tower chassis.
Product features
- Mesh front panel
S200 TG ARGB Snow mid-tower chassis comes with a large airflow-optimized mesh panel featuring an elegantly designed strip and a TT logo at the front for massive airflow performance. - Three preinstalled hydraulic bearing 120 mm ARGB lite front fans
S200 TG ARGB Snow mid-tower chassis comes with three pre-installed hydraulic bearing 120 mm ARGB Lite fans at the front of the case. - Built-in PSU cover
S200 TG ARGB Snow mid-tower chassis features a full length power supply cover providing plenty of space to tuck away cables, while keeping airflow clear for your hard drives and PSU. - Tempered glass panel
S200 TG ARGB Snow mid-tower chassis comes with one 3 mm tempered glass panel on the left side, thicker and more scratch resistant when compared to standard acrylic. On top of that, the enlarged window design enables you to display and admire all your components in their full RGB glory. - Opportunities for high-end expansion
S200 TG ARGB Snow mid-tower chassis has good expandability. It can support a CPU cooler with a maximum height of 166 mm, VGA placement of up to 330 mm in length (without radiator), a power supply with a length of up to 190 mm (with HDD Rack). Optimized for excellent cooling capability, the case comes with three hydraulic bearing 120 mm ARGB Lite fans preinstalled at the front; you can also choose to put two 140 mm fans at the front and on top, or up to six 120 mm fans can be fitted in. For radiator compatibility, it can support up to 360 mm at the front, giving more opportunities for high-end expansion! - Handy I/O ports
Two USB 3.0 ports, one HD audio and one reset button are placed on the top panel to grant direct access when needed.